Samsung, Ericsson, IBM, and Intel are teaming up to research and develop next-generation chips.
The US National Science Foundation (NSF) is funding this partnership and has awarded the tech giants $50 million for the project as part of its Future of Semiconductors initiative.
The NSF and the four tech giants will work on a “co-design” basis across different fronts to develop the next-gen chips. Samsung, Ericsson, IBM, and Intel will join forces and work hand-in-hand on areas including device performance, chip and system level, recyclability, environmental impact, and manufacturability.
According to NSF Director Sethuraman Panchanathan, “Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors.”
Through the $50 million funding, the NSF aims for this partnership between Samsung, Ericsson, IBM, and Intel to “inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”
This initiative is a part of NSF’s Future of Semiconductors (FuSe) Teaming Grants. According to the programme, progress in developing new processes, materials, devices, and architectures has been hindered by independent development. The foundation believes that a holistic, co-design approach can accelerate the development of “high-performance, robust, secure, compact, energy-efficient, and cost-effective solutions.”
